Comparison Samsung T7 Shield MU-PE4T0S 4 TB vs Samsung 870 EVO MZ-77E4T0BW 4 TB

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— Internal. Drives designed to be installed in a computer case. Designed for continuous operation within the same system, do not require frequent connection / disconnection. One of the most popular ways to use such modules is to store system files to speed up the loading and operation of the OS; although, of course, the internal SSD can also be used as a general-purpose drive.

— External. Drives in the form of external devices designed for constant reconnection. Use USB or Thunderbolt connectors of one version or another (see "Connector"). They are convenient, in particular, for transporting large volumes of data between different computers, especially if this data often has to be overwritten — external SSDs are more expensive than external hard drives, but they also work much faster.

— External / internal. Models that allow for both of the above use cases. Usually they are internal drives, supplemented by an external pocket(see below). However, such versatility is rarely required — most often the drive is bought for one specific use. Therefore, this variant was not distributed.

The connection connector(s) used in the drive. Note that for outdoor models (see "Type"), here, usually, the connector on the case of the drive itself is indicated; the ability to connect to a particular jack on a PC (or other device) depends mainly on the availability of appropriate cables. The exception is models with a non-removable wire — they are talking about a plug on such a wire.

Some form factors — for example, M.2 — use their own standard connector, so this parameter is not specified for such models. In other cases, the connectors can be conditionally divided into external and internal — depending on the type of drives (see above). In internal modules, in addition to the same M.2, you can find SATA 3, U.2 and SAS interfaces. External devices mainly use different types of USB — the classic USB connector (versions 3.2 gen1 or 3.2 gen2) or USB-C (versions 3.2 gen1, 3.2 gen2, 3.2 gen2x2 or USB4). In addition, there are solutions with the Thunderbolt interface (usually versions v2 or v3). Let's take a closer look at these options:

— SATA 3. The third version of the SATA interface, providing data transfer rates up to 5.9 Gbps...(about 600 MB / s). By SSD standards, this speed is low, since SATA was originally developed for hard drives and was not intended to be used with high-speed solid-state memory. Therefore, such a connection can be found mainly in low-cost and outdated internal drives.

— SAS. A standard designed as a high performance connection for server systems. Despite the emergence of more advanced interfaces, it is still found nowadays. Provides data transfer rates up to 22.5 Gbps (2.8 GB/s), depending on version.

— U.2. A connector specially designed for high-end internal drives in the 2.5 "form factor, mainly for server purposes. Actually, U.2 is the name of a specialized form factor (2.5", height 15 mm), and the connector is formally called SFF- 8639. Such modules are connected in the same way as PCI-E expansion cards (via the same bus), but they are smaller in size and can be hot-swapped.

— U.3. A three-interface connector based on the U.2 specification (see the relevant paragraph) and using the same SFF-8639 connector. The U.3 connector combines SAS, SATA and NVMe interfaces in one controller, allowing you to connect different types of drives through the same slot. U.3 provides separate pins for identifying a particular type of drive. The specification was created for internal 2.5" form factor drives. Such modules are miniature, hot-swappable, and support external control pulses.

— USB 3.2 gen1. Traditional full-size USB connector, compliant with version 3.2 gen1. This version (formerly known as 3.1 gen1 or 3.0) provides data rates up to 4.8 Gbps. It is compatible with other USB standards, except that the connection speed will be limited by the slowest version.

— USB 3.2 gen2. A traditional full size USB connector, corresponding to version 3.2 gen2 (previously known as 3.1 gen2 or simply 3.1). Operates at speeds up to 10 Gbps, otherwise the key features are similar to those described above USB 3.2 gen1

— USB-C 3.2 gen1. USB-C connector supporting 3.2 gen1. Recall that this version allows you to achieve speeds up to 4.8 Gbps. And USB-C is a relatively new type of USB connector, having a small size (slightly larger than microUSB), a symmetrical oval shape and a double-sided design. It is especially useful for external SSDs, given that such drives are getting smaller and smaller.

— USB-C 3.2 gen2. USB-C connector supporting version 3.2 gen2 connectivity — with data transfer rates up to 10 Gbps. However, such a drive will be able to work with slower USB ports — unless the speed will be limited by the capabilities of such a port. See above for details on the USB-C connector itself.

— USB-C 3.2 gen2x2. USB-C type connector supporting connection version 3.2 gen2x2. For more information about the connector itself, see above; and version 3.2 gen 2x2 (previously known as USB 3.2) allows to achieve speeds up to 20 Gbps — that is, twice as high as in the original 3.2 gen 2, hence the name. It is also worth noting that this version is implemented only through USB-C connectors and is not used in ports of earlier standards.

— USB4. A high-speed revision of the USB interface that uses only symmetrical USB type C connectors. Allows you to achieve data transfer rates of up to 40 Gbps (depending on the technologies and standards implemented in a particular port). The interface can support Thunderbolt v3 and v4, and is backward compatible with previous USB specifications, although devices with a full-size USB-A plug will require an adapter.

Model of the controller installed in the SSD.

The controller is a control circuit, which, in fact, ensures the exchange of information between the memory cells and the computer to which the drive is connected. The capabilities of a particular SSD module (in particular, read and write speed) largely depend on this particular scheme. Knowing the controller model, you can find detailed data on it and evaluate the capabilities of the drive. For simple everyday use, this information is usually not needed, but for professionals and enthusiasts (modders, overclockers) it can come in handy.

Nowadays, high-end controllers are produced mainly under such brands: InnoGrit, Maxio, Phison, Realtek, Silicon Motion, Samsung.

Buffer memory is a small chip on the SSD drive that acts as a data transit between the drive and the motherboard. In fact, it acts as a kind of intermediate link between the computer's RAM and the drive's own permanent memory. The buffer is used to store the most frequently requested data from the module, which reduces the access time to them — the information is sent from the cache, instead of being read from the magnetic media. Usually, the larger the buffer size, the higher the speed of the drive, all other things being equal. Also, drives with a large amount of buffer memory reduce the load on the processor.

The type of the main memory of the drive determines the features of the distribution of information over hardware cells and the physical features of the cells themselves.

— MLC. Multi Level Cell memory based on multi-level cells, each of which contains several signal levels. MLC memory cells store 2 bits of information. Has optimum indicators of reliability, power consumption and productivity. Until recently, the technology was popular in entry-level and mid-range SSD modules, now it is gradually being replaced by more advanced options in the manner of TLC or 3D MLC.

— TLC. The evolution of MLC technology. One Flash Memory Triple Level Cell can store 3 bits of information. Such a recording density somewhat increases the likelihood of errors compared to MLC, in addition, TLC memory is considered less durable. A positive feature of the nature of this technology is its affordable cost, and various design tricks can be used to improve reliability in SSDs with TLC memory.

— 3D NAND. In a 3D NAND structure, several layers of memory cells are arranged vertically, and interconnections are organized between them. This provides greater storage capacity without increasing the physical size of the drive and improves memory performance due to shorter connections for each memory cell. In SSD drives, 3D NAND memory can use MLC, TLC or QLC chips - more details...about them are described in the corresponding help paragraphs.

— 3D MLC NAND. MLC-memory has a multilayer structure — its cells are placed on the board not in one level, but in several "floors". As a result, manufacturers have achieved an increase in storage capacity without a noticeable increase in size. Also, 3D MLC NAND memory is characterized by higher reliability than the original MLC (see the relevant paragraph), at a lower manufacturing cost.

— 3D TLC NAND. "Three-dimensional" modification of the TLC technology (see the relevant paragraph) with the placement of memory cells on the board in several layers. This arrangement allows you to achieve higher capacity with smaller sizes of the drives themselves. In production, such memory is simpler and cheaper than a single-layer one.

— 3D QLC NAND. Quad Level Cell flash type with 4 bits of data in each cell. The technology is designed to make SSDs with large volumes widely available and finally retire traditional HDDs. In the 3D QLC NAND configuration, the memory is built according to a “multi-level” scheme with the placement of cells on the board in several layers. "Three-dimensional" structure reduces the cost of production of memory modules and allows you to increase the volume of drives without compromising their weight and size component.

— 3D XPoint. A fundamentally new type of memory, radically different from traditional NAND. In such drives, memory cells and selectors are located at the intersections of perpendicular rows of conductive tracks. The mechanism for recording information in cells is based on changing the resistance of the material without the use of transistors. 3D XPoint memory is simple and inexpensive to produce, and offers much better speed and durability. The prefix "3D" in the name of the technology says that the cells on the crystal are placed in several layers. The first generation of 3D XPoint received a two-layer structure and was made using a 20-nanometer process technology.

NVMe drive support.

NVMe is a communication protocol designed specifically for SSD modules and used when connected via the PCI-E bus. This protocol was developed to eliminate the shortcomings of earlier connection standards (like SCSI or SATA) — primarily low speed, which did not allow realizing the full capabilities of solid-state memory. NVMe takes into account the key advantages of SSD — independent access, multithreading and low latency. Support for this protocol is built into all major modern operating systems; it works not only through the original PCIe interface, but also through M.2 (see Form Factor). And the U.2 connector was generally created specifically for NVMe SSDs (although the presence of this connector in itself does not mean compatibility with this protocol).

The highest speed in write mode characterizes the speed with which the module can receive information from a connected computer (or other external device). This speed is limited both by the connection interface (see "Connector"), and by the characteristics of the device of the SSD itself.

The highest data exchange rate with a computer (or other external device) that the drive can provide in read mode; in other words — the highest speed of information output from the drive to an external device. This speed is limited both by the connection interface (see "Connector"), and by the characteristics of the device of the SSD itself. Its values can vary from 100 – 500 MB / s in the slowest models to 3 Gb / s and higher in the most advanced ones.

A parameter that determines the resistance of the drive to drops and shocks during operation. Measured in G — units of overload, 1 G corresponds to the usual force of gravity. The higher the G number, the more resistant the device is to various kinds of shocks and the less likely it is to damage the data in it, say, in the event of a fall. This parameter is especially important for external drives (see Type).