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Gigabyte X670E AORUS PRO X

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Gigabyte X670E AORUS PRO X
Towards:gaming
Form Factor:ATX
Socket:AMD AM5
Chipset:AMD X670E
BIOS:Ami
RAM slots:DDR5 4 sl
RAM form factor:DIMM
RAM clock:8000 MHz
Sound (channels):7.1
Connectors:HDMI, M.2
Power connector:24 pin
Processor power:8+8 pin
The element base consists of Infineon TDA21472 (70 A) and OnSemi NCP303160 (60 A) microcircuits, as well as OnSemi NTMFS4C10N (46 A) and OnSemi NTMFS4C06 mosfets. The core power subsystem is controlled by an Infineon XDPE192C3B PWM controller.
Four M.2 connectors. A couple of them are connected to the PCI-E 5.0 x4 bus, while the other two are connected to PCI-E 4.0 x4. To simplify the installation of 2280 format drives, the board has an M.2 EZ-Latch. For cooling, two separate radiators with thermal pads are used.

High-performance gaming board with high overclocking potential, designed for use with AMD Ryzen processors on socket AM5. At the time of writing this material (note: January 2024), the list of supported processors includes the Ryzen 7000 Raphael and Ryzen 8000 Phoenix models, which, unlike earlier Ryzen chips, are based on a fundamentally new Zen 4 microarchitecture. The AMD X670E chipset installed in the board supports everything the latest modern technologies, including the PCI-Express 5.0 data bus, which provides high system throughput, which is especially important when using advanced SSD drives and the latest generation video cards.

An important advantage of the Gigabyte X670E AORUS PRO X is support for up to 192 GB of RAM in DDR5 format - the latest standard that has just begun to conquer the market. In turn, the disk subsystem has 4 M.2 ports: 2 PCI-E 4.0 ports (M2A_CPU, M2B_CPU) and 2 PCI-E 5.0 ports, as well as 4 classic SATA 3 connectors. All this allows us to consider the Gigabyte X670E AORUS PRO X in the role of the basis of the workstation for creating and processing content.

The ATX form factor and impressive dimensions (305x244 mm) indicate its suitability for assembling powerful desktop systems. The board also features an impressive 20-phase power supply (16+2+2), which ensures stability and efficiency under increased loads, especially overclocking. The element base is made at an extremely serious level and consists of Infineon TDA21472 (70 A), OnSemi NCP303160 (60 A) microcircuits, as well as OnSemi NTMFS4C10N (46 A) and OnSemi NTMFS4C06 mosfets.

The core power subsystem is controlled by an Infineon XDPE192C3B PWM controller. In addition, the list of advantages of the model includes an M.2 heatsink with a screwless design, M.2 slots with quick locking, a built-in touchpad port, a modified BIOS interface with quick access functions, a massive VRM heatsink and additional thermal pads, and a high-quality audio path with support multi-channel sound and audiophile-grade capacitors. In addition to this, the board has a network controller with a bandwidth of 2.5 Gbps and a built-in wireless receiver that supports the new Wi-Fi 7 standard, but is also backward compatible with earlier versions.

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