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MSI SPATIUM M570 PRO PCIe 5.0 NVMe M.2 FROZR S78-440Q670-P83 2 TB

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MSI SPATIUM M570 PRO PCIe 5.0 NVMe M.2 FROZR [S78-440Q670-P83]
from $239.99 up to $269.60 
MSI S78-440Q670-P83
Placement
internal
Size
2000 GB
Form factor
M.2
M.2 interface
PCI-E 5.0 4x
Controller
Phison PS5026-E26
Cache memory
4000 MB / Hynix LPDDR4-4266 /
Memory type
3D TLC NAND / Micron 232-Layer /
Write speed
11800 MB/s
Read speed
12400 MB/s
MTBF
1.6 m h
Write IOPS
1500 K
Read IOPS
1500 K
TBW
1400 TB
DWPD
0.4 times/day
Manufacturer's warranty
5 years
TRIM
Data encryption
/ AES256/OPAL 2.0 /
M.2 cooling
radiator
Size
94.8х24х71.65 mm / radiator /
Official Website
msi.com
Added to E-Catalog
December 2023
5-core (2+3) Phison PS5026-E26 controller, made using a 12 nm process technology. Four 232-layer Micron MT29F4T08EMLCHD4-QA:C 3D NAND TLC flash memory chips are soldered on the other end of the PCB, two on each side.
The radiator is made of an aluminium base and thin fins piercing three heat pipes, two of which protrude greatly beyond the structure. The tubes are in direct contact with the M.2 drive through a thermal pad.

Representative of the new generation of high-performance Gen5 NVMe SSDs with top-notch components, a large-sized heatsink, and record-breaking read and write speeds. Part of the MSI Spatium 2025 lineup, positioned by the manufacturer as a flagship solution for enthusiasts, content creators, and gamers. The MSI Spatium M570 Pro drive is based on the 5-core Phison PS5026-E26 controller, manufactured using a 12 nm process.

Its architecture (2 general-purpose cores + 3 specialized cores) ensures not only high throughput but also excellent energy efficiency. The use of 4 GB Hynix LPDDR4-4266 buffer memory guarantees stable drive operation at peak speeds even under heavy load. Thanks to the support of the PCI-E 5.0 interface, the device delivers impressive speeds (read up to 12,400 MB/s, write up to 11,800 MB/s), allowing it to fully unleash the potential of modern systems based on Intel Z790/Z890 and AMD X670E/B650E chipsets.

This option is especially relevant for highly demanding work scenarios, including multi-threaded 8K video editing, working with large 3D projects, and single-channel three-dimensional audio. For data storage, four 232-layer Micron 3D TLC NAND memory chips are used, forming a 2000 GB memory pool. This is one of the most advanced configurations on the market, providing not only high speeds but also impressive durability (TBW — 1400 TB, 1.6 million hours MTBF). The picture is completed by a massive heatsink resembling a tower cooler, with an aluminum base, dense fin layout, and three heat pipes.

The information in the model description is for reference purposes.
Always clarify the specifications and configuration of the product with the online store manager before purchasing.
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