Comparison AMD Ryzen 5 Matisse 3600 BOX vs AMD Ryzen 5 Pinnacle Ridge 2600X BOX

This parameter characterizes, firstly, the technical process (see above), and secondly, some features of the internal structure of processors. A new (or at least updated) codename is introduced to the market with each new CPU generation; chips of the same architecture are "coevals", but may belong to different series (see above). At the same time, one generation can include both one and several code names.

Here are the most common Intel codenames today: Cascade Lake-X (10th gen), Comet Lake (10th gen), Comet Lake Refresh (10th generation), Rocket Lake (11th generation), Alder Lake (12th generation), Raptor Lake (13th generation), Raptor Lake Refresh (14th generation), Raptor Lake (Series 1), Arrow Lake (Series 2).

For AMD, this list includes Zen+ Picasso, Zen2 Matisse, Zen2 Renoir, Zen3 Vermeer, Zen3 Cezanne, Zen4 Raphael, Zen4 Phoenix and Zen5 Granite Ridge.

The technical process by which the CPU is manufactured.

The parameter is usually specified by the size of the individual semiconductor elements (transistors) that make up the processor integrated circuit. The smaller their size, the more advanced the technical process is considered: miniaturization of individual elements allows you to reduce heat generation, reduce the overall size of the processor and at the same time increase its flow Rate. CPU manufacturers are trying to move towards reducing the technical process, and the newer the processor, the lower the numbers you can see at this point.

The technical process is measured in nanometers (nm). In the modern arena of central processors, solutions made using the 7 nm, 10 nm, 12 nm process technology predominate, high-end CPU models are manufactured using the 4 nm and 5 nm process technology, 14 nm and 22 nm solutions are still afloat, and are rapidly fading into the background, but 28 nm and 32 nm occur periodically.

The amount of Level 1 (L1) cache provided by the processor.

Cache is an intermediate memory buffer into which the most frequently used data from RAM is written when the processor is running. This speeds up access to them and has a positive effect on system performance. The larger the cache, the more data can be stored in it for quick access and the higher the performance. Level 1 cache has the highest performance and the smallest volume — up to 128 KB. It is an integral part of any processor.

The amount of cache level 3 (L3) provided in the processor.

Cache is an intermediate memory buffer into which the most frequently used data from RAM is written when the processor is running. This speeds up access to them and has a positive effect on system performance. The larger the cache, the more data can be stored in it for quick access and the higher the performance.

The amount of heat generated by the processor during normal operation. This parameter determines the requirements for the cooling system necessary for the normal operation of the processor, therefore it is sometimes called TDP — thermal design power, literally “thermal (cooling) system power”. Simply put, if the processor has a heat dissipation of 60 W, it needs a cooling system that can remove at least this amount of heat. Accordingly, the lower the TDP, the lower the requirements for the cooling system. Low TDP values(up to 50 W) are especially critical for PCs that do not have the ability to install powerful cooling systems — in particular, systems in compact cases where a powerful cooler simply does not fit.

A universal interface for connecting internal peripherals. In practice, the supported data transfer speed may vary depending on the version of the interface and the number of lanes (data transfer channels). Version 3.0 has a data transfer speed of 8 GT/s (Gigatransactions/s), PCIe 4.0 is doubled — from 8 to 16 GT/s, and 5.0 — to 64 GT/s.

The maximum temperature at which the processor is able to effectively continue to work — when heated above this temperature, most modern processors are turned off in order to avoid the unpleasant consequences of overheating (up to the burning of the chip). The higher the maximum operating temperature, the less demanding the processor is on the cooling system, however, the cooling power anyway should not be lower than TDP (see Heat Dissipation (TDP)).

The result shown by the processor in the Passmark CPU Mark test.

Passmark CPU Mark is a comprehensive test that checks not only the gaming capabilities of the CPU, but also its performance in other modes, based on which it displays the overall score; this score can be used to fairly reliably evaluate the processor as a whole.

The result shown by the processor in the test (benchmark) Geekbench 4.

Geekbench 4 is a comprehensive cross-platform test that allows, among other things, to determine the efficiency of the processor in various modes. At the same time, according to the developers, the verification modes are as close as possible to various real tasks that the processor has to solve. The result is indicated in points: the more points — the more powerful the CPU, while the difference in numbers corresponds to the actual difference in performance ("twice the result — twice the power").

Note that the benchmark in Geekbench 4 is the Intel Core i7-6600U processor with a clock frequency of 2.6 GHz. Its power is estimated at 4000 points, and the performance of other tested CPUs is already compared with it.