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Comparison AMD Ryzen 7 Matisse 3700X OEM vs AMD Ryzen 7 Pinnacle Ridge 2700X OEM

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AMD Ryzen 7 Matisse 3700X OEM
AMD Ryzen 7 Pinnacle Ridge 2700X OEM
AMD Ryzen 7 Matisse 3700X OEMAMD Ryzen 7 Pinnacle Ridge 2700X OEM
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SeriesRyzen 7Ryzen 7
Code nameMatisse (Zen 2)Pinnacle Ridge (Zen+)
SocketAMD AM4AMD AM4
Lithography7 nm12 nm
In box  
Cores and Threads
Cores8 cores8 cores
Threads16 threads16 threads
Multithreading
Speed
Clock speed3.6 GHz3.7 GHz
TurboBoost / TurboCore4.4 GHz4.3 GHz
Cache
L1 cache768 KB
L2 cache4096 KB4096 KB
L3 cache32 MB16 MB
Specs
IGPis absentis absent
TDP65 W105 W
Instruction
MMX+, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4A, AMD-V, AES, AVX /AVX2, FMA3, SHA/
MMX+, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4A, AMD-V, AES, AVX /AVX2, FMA3, SHA/
Multiplier36
Free multiplier
PCI Express4.03.0
Max. operating temperature85 °С
Passmark CPU Mark24121 score(s)17564 score(s)
Geekbench 436561 score(s)28164 score(s)
Cinebench R152114 score(s)1836 score(s)
Memory
Max. RAM128 GB64 GB
Max. DDR4 speed3200 MHz2933 MHz
Channels22
Added to E-Catalogmay 2019may 2018

Code name

This parameter characterizes, firstly, the technical process (see above), and secondly, some features of the internal structure of processors. A new (or at least updated) codename is introduced to the market with each new CPU generation; chips of the same architecture are "coevals", but may belong to different series (see above). At the same time, one generation can include both one and several code names.

Here are the most common Intel codenames today: Cascade Lake-X (10th gen), Comet Lake (10th gen), Comet Lake Refresh (10th generation), Rocket Lake (11th generation), Alder Lake (12th generation), Raptor Lake (13th generation), Raptor Lake Refresh (14th generation).

For AMD, this list includes Zen+ Picasso, Zen2 Matisse, Zen2 Renoir, Zen3 Vermeer, Zen3 Cezanne, Zen4 Raphael, Zen4 Phoenix and Zen5 Granite Ridge.

Lithography

The technical process by which the CPU is manufactured.

The parameter is usually specified by the size of the individual semiconductor elements (transistors) that make up the processor integrated circuit. The smaller their size, the more advanced the technical process is considered: miniaturization of individual elements allows you to reduce heat generation, reduce the overall size of the processor and at the same time increase its flow Rate. CPU manufacturers are trying to move towards reducing the technical process, and the newer the processor, the lower the numbers you can see at this point.

The technical process is measured in nanometers (nm). In the modern arena of central processors, solutions made using the 7 nm, 10 nm, 12 nm process technology predominate, high-end CPU models are manufactured using the 4 nm and 5 nm process technology, 14 nm and 22 nm solutions are still afloat, and are rapidly fading into the background, but 28 nm and 32 nm occur periodically.

Clock speed

The number of cycles per second that the processor produces in its normal operating mode. A clock is a single electrical impulse used to process data and synchronize the processor with the rest of the computer system. Different operations may require fractions of a clock or several clocks, but anyway, the clock frequency is one of the main parameters characterizing the performance and speed of the processor — all other things being equal, a processor with a higher clock frequency will work faster and better cope with significant loads. At the same time, it should be taken into account that the actual performance of the chip is determined not only by the clock frequency, but also by a number of other characteristics — from the series and architecture (see the relevant paragraphs) to the number of cores and support for special instructions. So it makes sense to compare by clock frequency only chips with similar characteristics belonging to the same series and generation.

TurboBoost / TurboCore

The maximum processor clock speed that can be reached when running in Turbo Boost or Turbo Core overclocking mode.

The name "Turbo Boost" is used for the overclocking technology used by Intel, "Turbo Core" for the solution from AMD. The principle of operation in both cases is the same: if some cores are not used or work under a load below the maximum, the processor can transfer part of the load from the loaded cores to them, thus increasing computing power and performance. Operation in this mode is characterized by an increase in the clock frequency, and it is indicated in this case.

Note that we are talking about the maximum possible clock frequency — modern CPUs are able to regulate the operating mode depending on the situation, and with a relatively low load, the actual frequency may be lower than the maximum possible. See "Clock frequency" for the general meaning of this parameter.

L1 cache

The amount of Level 1 (L1) cache provided by the processor.

Cache is an intermediate memory buffer into which the most frequently used data from RAM is written when the processor is running. This speeds up access to them and has a positive effect on system performance. The larger the cache, the more data can be stored in it for quick access and the higher the performance. Level 1 cache has the highest performance and the smallest volume — up to 128 KB. It is an integral part of any processor.

L3 cache

The amount of cache level 3 (L3) provided in the processor.

Cache is an intermediate memory buffer into which the most frequently used data from RAM is written when the processor is running. This speeds up access to them and has a positive effect on system performance. The larger the cache, the more data can be stored in it for quick access and the higher the performance.

TDP

The amount of heat generated by the processor during normal operation. This parameter determines the requirements for the cooling system necessary for the normal operation of the processor, therefore it is sometimes called TDP — thermal design power, literally “thermal (cooling) system power”. Simply put, if the processor has a heat dissipation of 60 W, it needs a cooling system that can remove at least this amount of heat. Accordingly, the lower the TDP, the lower the requirements for the cooling system. Low TDP values(up to 50 W) are especially critical for PCs that do not have the ability to install powerful cooling systems — in particular, systems in compact cases where a powerful cooler simply does not fit.

Multiplier

The coefficient on the basis of which the value of the processor clock frequency is displayed. The latter is calculated by multiplying the multiplier by the system bus frequency (see System bus frequency). For example, with a system bus frequency of 533 MHz and a multiplier of 4, the processor clock speed will be approximately 2.1 GHz.

PCI Express

Universal interface for connecting internal peripherals. Provides generally higher speeds than SATA. In fact, the supported data transfer rate may be different — depending on the version of the interface and the number of lines (data transmission channels). Version 3.0 provides speeds of about 1 GB/s per lane, PCI-E 4.0 about 2 GB/s per lane, and 5.0 up to 4 GB/s per lane.
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