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Comparison AMD Ryzen 5 Matisse 3600 WOF vs AMD Ryzen 5 Cezanne 5500 OEM

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AMD Ryzen 5 Matisse 3600 WOF
AMD Ryzen 5 Cezanne 5500 OEM
AMD Ryzen 5 Matisse 3600 WOFAMD Ryzen 5 Cezanne 5500 OEM
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SeriesRyzen 5Ryzen 5
Code nameMatisse (Zen 2)Cezanne (Zen 3)
SocketAMD AM4AMD AM4
Lithography7 nm7 nm
In boxBOX (no cooler) 
Cores and Threads
Cores6 cores6 cores
Threads12 threads12 threads
Multithreading
Speed
Clock speed3.6 GHz3.6 GHz
TurboBoost / TurboCore4.2 GHz4.2 GHz
Cache
L1 cache384 KB
L2 cache3072 KB3072 KB
L3 cache32 MB16 MB
Specs
IGPis absentis absent
TDP65 W65 W
Instruction
MMX+, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4A, AMD-V, AES, AVX /AVX2, FMA3, SHA/
Multiplier36
Free multiplier
PCI Express4.03.0
Max. operating temperature90 °С
Passmark CPU Mark19975 score(s)19554 score(s)
Geekbench 429836 score(s)
Cinebench R151578 score(s)
Memory
Max. RAM128 GB
Max. DDR4 speed3200 MHz3200 MHz
Channels22
Added to E-Catalogoctober 2022april 2022

Code name

This parameter characterizes, firstly, the technical process (see above), and secondly, some features of the internal structure of processors. A new (or at least updated) codename is introduced to the market with each new CPU generation; chips of the same architecture are "coevals", but may belong to different series (see above). At the same time, one generation can include both one and several code names.

Here are the most common Intel codenames today: Cascade Lake-X (10th gen), Comet Lake (10th gen), Comet Lake Refresh (10th generation), Rocket Lake (11th generation), Alder Lake (12th generation), Raptor Lake (13th generation), Raptor Lake Refresh (14th generation).

For AMD, this list includes Zen+ Picasso, Zen2 Matisse, Zen2 Renoir, Zen3 Vermeer, Zen3 Cezanne, Zen4 Raphael, Zen4 Phoenix and Zen5 Granite Ridge.

In box

This parameter does not so much indicate the difference in technical characteristics as it describes the packaging and computer Hardware.

- OEM. The tray package, or OEM, provides that the processor is supplied without a cooling system (CO) and without a branded box - the packaging is usually a simple antistatic bag. You need to select and install cooling for such a CPU separately. In addition, components in tray packaging often have a shorter warranty period than in the box version, and their additional equipment is more meager. On the other hand, such solutions are noticeably cheaper, and the absence of CO allows you to select it separately, without relying on the manufacturer’s choice.

BOX (without cooler). Processors packed in branded boxes, but not equipped with cooling systems (CO). Such packaging is more expensive than OEM, but the warranty period for “boxed” chips is usually much longer (for example, three years instead of one). The absence of a cooler, on the one hand, requires additional efforts to find and install a coolant; on the other hand, cooling can be selected according to your own criteria, without relying on the manufacturer’s choice. However, it is worth considering that when installing a cooler yourself, it is difficult to achieve the same efficiency from it as with a factory installation; This is especially critical if the CPU is planned to be intensively overc...locked; for such modes it is better to choose a box package with a cooler.

BOX (with cooler). Processors packed in branded boxes and equipped with cooling systems (CO). Box packaging itself is more expensive than OEM, but this is compensated by a number of advantages - in particular, more extensive packaging and a longer warranty period. As for the presence of a cooler in the kit, it further increases the overall cost of the CPU, but eliminates the need to bother with the selection and installation of a separate cooling system. It is worth noting that the factory installation of CO allows you to achieve higher efficiency than independent installation, so for high loads (including overclocking) this particular configuration option is best suited. On the other hand, before purchasing, you need to check whether there is enough space in the case for a cooler: complete coolers can be quite bulky, and removing them can be difficult.

MPK (with cooler, without box). The multipack package, or MPK for short, implies the delivery of a processor with a standard boxed cooling cooler, but without a box and accompanying documentation. The processor is usually packaged in a simple antistatic bag. The MPK package is more expensive than OEM due to the presence of a cooling system, but cheaper than BOX (with cooler) due to the absence of a box. At the same time, the multipack kit usually has a shorter warranty period than the BOX delivery option (with a cooler).

L1 cache

The amount of Level 1 (L1) cache provided by the processor.

Cache is an intermediate memory buffer into which the most frequently used data from RAM is written when the processor is running. This speeds up access to them and has a positive effect on system performance. The larger the cache, the more data can be stored in it for quick access and the higher the performance. Level 1 cache has the highest performance and the smallest volume — up to 128 KB. It is an integral part of any processor.

L3 cache

The amount of cache level 3 (L3) provided in the processor.

Cache is an intermediate memory buffer into which the most frequently used data from RAM is written when the processor is running. This speeds up access to them and has a positive effect on system performance. The larger the cache, the more data can be stored in it for quick access and the higher the performance.

Instruction

Support by the processor of various sets of additional commands. These can be instructions that optimize the operation of the processor as a whole or with applications of a certain type (for example, multimedia, or 64-bit), prevent certain types of viruses from running on the computer, etc. Each manufacturer has its own assortment of instructions for CPUs.

Multiplier

The coefficient on the basis of which the value of the processor clock frequency is displayed. The latter is calculated by multiplying the multiplier by the system bus frequency (see System bus frequency). For example, with a system bus frequency of 533 MHz and a multiplier of 4, the processor clock speed will be approximately 2.1 GHz.

Free multiplier

The ability to change the value of the multiplier (see Multiplier) of the processor at will. Unlike overclocking ("overclocking") in its classical sense, often associated with hacking processor settings, a free multiplier makes it possible to "legally" and quite easily change the processor clock frequency — most often this is implemented through BIOS settings. At the same time, do not forget that the increased frequency of the processor requires the appropriate efficiency of the cooling system.

PCI Express

Universal interface for connecting internal peripherals. Provides generally higher speeds than SATA. In fact, the supported data transfer rate may be different — depending on the version of the interface and the number of lines (data transmission channels). Version 3.0 provides speeds of about 1 GB/s per lane, PCI-E 4.0 about 2 GB/s per lane, and 5.0 up to 4 GB/s per lane.

Max. operating temperature

The maximum temperature at which the processor is able to effectively continue to work — when heated above this temperature, most modern processors are turned off in order to avoid the unpleasant consequences of overheating (up to the burning of the chip). The higher the maximum operating temperature, the less demanding the processor is on the cooling system, however, the cooling power anyway should not be lower than TDP (see Heat Dissipation (TDP)).
AMD Ryzen 5 Matisse often compared
AMD Ryzen 5 Cezanne often compared