Comparison AMD Ryzen 7 Vermeer 5800X BOX vs AMD Ryzen 7 Matisse 3700X BOX

This parameter characterizes, firstly, the technical process (see above), and secondly, some features of the internal structure of processors. A new (or at least updated) codename is introduced to the market with each new CPU generation; chips of the same architecture are "coevals", but may belong to different series (see above). At the same time, one generation can include both one and several code names.

Here are the most common Intel codenames today: Cascade Lake-X (10th gen), Comet Lake (10th gen), Comet Lake Refresh (10th generation), Rocket Lake (11th generation), Alder Lake (12th generation), Raptor Lake (13th generation), Raptor Lake Refresh (14th generation), Raptor Lake (Series 1), Arrow Lake (Series 2).

For AMD, this list includes Zen+ Picasso, Zen2 Matisse, Zen2 Renoir, Zen3 Vermeer, Zen3 Cezanne, Zen4 Raphael, Zen4 Phoenix and Zen5 Granite Ridge.

This parameter does not so much indicate the difference in technical characteristics as it describes the packaging and computer Hardware.

- OEM. The tray package, or OEM, provides that the processor is supplied without a cooling system (CO) and without a branded box - the packaging is usually a simple antistatic bag. You need to select and install cooling for such a CPU separately. In addition, components in tray packaging often have a shorter warranty period than in the box version, and their additional equipment is more meager. On the other hand, such solutions are noticeably cheaper, and the absence of CO allows you to select it separately, without relying on the manufacturer’s choice.

— BOX (without cooler). Processors packed in branded boxes, but not equipped with cooling systems (CO). Such packaging is more expensive than OEM, but the warranty period for “boxed” chips is usually much longer (for example, three years instead of one). The absence of a cooler, on the one hand, requires additional efforts to find and install a coolant; on the other hand, cooling can be selected according to your own criteria, without relying on the manufacturer’s choice. However, it is worth considering that when installing a cooler yourself, it is difficult to achieve the same efficiency from it as with a factory installation; This is especially critical if the CPU is planned to be intensively overc...locked; for such modes it is better to choose a box package with a cooler.

— BOX (with cooler). Processors packed in branded boxes and equipped with cooling systems (CO). Box packaging itself is more expensive than OEM, but this is compensated by a number of advantages - in particular, more extensive packaging and a longer warranty period. As for the presence of a cooler in the kit, it further increases the overall cost of the CPU, but eliminates the need to bother with the selection and installation of a separate cooling system. It is worth noting that the factory installation of CO allows you to achieve higher efficiency than independent installation, so for high loads (including overclocking) this particular configuration option is best suited. On the other hand, before purchasing, you need to check whether there is enough space in the case for a cooler: complete coolers can be quite bulky, and removing them can be difficult.

— MPK (with cooler, without box). The multipack package, or MPK for short, implies the delivery of a processor with a standard boxed cooling cooler, but without a box and accompanying documentation. The processor is usually packaged in a simple antistatic bag. The MPK package is more expensive than OEM due to the presence of a cooling system, but cheaper than BOX (with cooler) due to the absence of a box. At the same time, the multipack kit usually has a shorter warranty period than the BOX delivery option (with a cooler).

The number of cycles per second that the processor produces in its normal operating mode. A clock is a single electrical impulse used to process data and synchronize the processor with the rest of the computer system. Different operations may require fractions of a clock or several clocks, but anyway, the clock frequency is one of the main parameters characterizing the performance and speed of the processor — all other things being equal, a processor with a higher clock frequency will work faster and better cope with significant loads. At the same time, it should be taken into account that the actual performance of the chip is determined not only by the clock frequency, but also by a number of other characteristics — from the series and architecture (see the relevant paragraphs) to the number of cores and support for special instructions. So it makes sense to compare by clock frequency only chips with similar characteristics belonging to the same series and generation.

The maximum processor clock speed that can be reached when running in Turbo Boost or Turbo Core overclocking mode.

The name "Turbo Boost" is used for the overclocking technology used by Intel, "Turbo Core" for the solution from AMD. The principle of operation in both cases is the same: if some cores are not used or work under a load below the maximum, the processor can transfer part of the load from the loaded cores to them, thus increasing computing power and performance. Operation in this mode is characterized by an increase in the clock frequency, and it is indicated in this case.

Note that we are talking about the maximum possible clock frequency — modern CPUs are able to regulate the operating mode depending on the situation, and with a relatively low load, the actual frequency may be lower than the maximum possible. See "Clock frequency" for the general meaning of this parameter.

The amount of heat generated by the processor during normal operation. This parameter determines the requirements for the cooling system necessary for the normal operation of the processor, therefore it is sometimes called TDP — thermal design power, literally “thermal (cooling) system power”. Simply put, if the processor has a heat dissipation of 60 W, it needs a cooling system that can remove at least this amount of heat. Accordingly, the lower the TDP, the lower the requirements for the cooling system. Low TDP values(up to 50 W) are especially critical for PCs that do not have the ability to install powerful cooling systems — in particular, systems in compact cases where a powerful cooler simply does not fit.

Support by the processor of various sets of additional commands. These can be instructions that optimize the operation of the processor as a whole or with applications of a certain type (for example, multimedia, or 64-bit), prevent certain types of viruses from running on the computer, etc. Each manufacturer has its own assortment of instructions for CPUs.

The coefficient on the basis of which the value of the processor clock frequency is displayed. The latter is calculated by multiplying the multiplier by the system bus frequency (see System bus frequency). For example, with a system bus frequency of 533 MHz and a multiplier of 4, the processor clock speed will be approximately 2.1 GHz.

The number of individual data transfer channels through which the CPU exchanges information with graphics cards, storage devices, and other high-speed devices. For example, a graphics card slot usually operates in x16 mode, whereas a modern M.2 SSD often requires x4 lanes. A greater number of lanes is especially important for workstations, gaming PCs with multiple storage devices, and systems with additional expansion cards.

The result shown by the processor in the Passmark CPU Mark test.

Passmark CPU Mark is a comprehensive test that checks not only the gaming capabilities of the CPU, but also its performance in other modes, based on which it displays the overall score; this score can be used to fairly reliably evaluate the processor as a whole.