Comparison ID-COOLING SE-903 vs ID-COOLING SE-903-B

— Auto (PWM). A type of automatic regulator used in processor cooling systems. The principle of this adjustment is that the automation monitors the current load on the CPU and adjusts the fan operation mode to it. Thus, the cooling system works "in advance": it actually prevents the temperature rise, and does not eliminate it (unlike the thermostat described below). The disadvantages of such automation are the high cost and additional compatibility requirements: the PWM function must be supported by the motherboard, and the fan must be powered through a 4-pin connector (see "Power").

— Manual. Manual regulator that allows you to set the rotation speed at the request of the user. Its main advantages are both the possibility of arbitrary adjustment and reliability: automation does not always respond optimally, and in performant systems it is sometimes better for the user to take control into his own hands. On the other hand, manual control is more expensive and also more difficult to use — it requires the user to pay more attention to the state of the system, and if not attentive, the likelihood of overheating increases significantly.

— Manual / auto. A combination of the two systems described above: the main control is carried out by PWM, and the manual regulator serves to limit the maximum rotational speed. A fairly convenient and advanced option that expands the possibilities of auto-adjustment and at the same time doe...s not require constant temperature control, as with a purely manual setting. However such functionality is expensive.

— Adapter (resistor). In this case, the speed is adjusted by reducing the voltage supplied to the fan. To do this, it is connected to the power supply through a resistor adapter. This is a kind of alternative to manual adjustment: adapters are inexpensive. On the other hand, they are much less convenient: the only way to change the rotation speed with such an adjustment is to actually change the adapter, and for this you have to turn off the system and climb into the case.

— Thermostat. Automatic speed control according to data from a sensor that measures the temperature of the cooled component: when the temperature rises, the intensity of work also increases, and vice versa. Such systems are simpler than the PWMs described above, moreover, they can be used for almost any system component, not only for CPU. On the other hand, they have more inertia and reaction time: if the PWM prevents heating in advance, then the thermostat is triggered by an increase in temperature that has already happened.

The maximum static air pressure generated by the fan during operation.

This parameter is measured as follows: if the fan is installed on a blind pipe, from which there is no air outlet, and turned on for blowing, then the pressure reached in the pipe will correspond to the static one. In fact, this parameter determines the overall efficiency of the fan: the higher the static pressure (ceteris paribus), the easier it is for the fan to “push” the required amount of air through a space with high resistance, for example, through narrow slots of a radiator or through a case full of components.

Also, this parameter is used for some specific calculations, however, these calculations are quite complex and, usually, are not necessary for an ordinary user — they are associated with nuances that are relevant mainly for computer enthusiasts. You can read more about this in special sources.

The type of contact between the heat pipes provided in the heatsink of the cooling system and the cooled components (usually the CPU). For more information about heat pipes, see above, and the types of contact can be as follows:

— Indirect. The classic version of the design: heat pipes pass through a metal (usually aluminium) base, which is directly adjacent to the surface of the chip. The advantage of such contact is the most even distribution of heat between the tubes, regardless of the physical size of the chip itself (the main thing is that it should not be larger than the sole). At the same time, the extra piece between the processor and the tubes inevitably increases thermal resistance and slightly reduces the overall cooling efficiency. In many systems, especially high-end ones, this drawback is compensated by various design solutions (primarily by the tightest connection of the tubes with the sole), but this, in turn, affects the cost.

— Direct. With direct contact, the heat pipes fit directly on the cooled chip, without an additional sole; for this, the surface of the tubes on the desired side is ground down to a plane. Due to the absence of intermediate parts, the thermal resistance at the places where the tubes fit is minimal, and at the same time, the radiator design itself is simpler and cheaper than with indirect contact. On the other hand, there are gaps between the heat...pipes, sometimes very large — as a result, the surface of the serviced chip is cooled unevenly. This is partly offset by the presence of a substrate (in this case, it fills these gaps) and the use of thermal paste, however, in terms of uniformity of heat removal, direct contact is still inevitably inferior to indirect contact. Therefore, this option is found mainly in inexpensive coolers, although it can also be used in fairly performant solutions.

The material from which the substrate of the cooling system is made is the surface that is in direct contact with the cooled component (most often the processor). This parameter is especially important for models with heat pipes (see above), although it can be specified for coolers without this function. Options can be as follows: aluminium, nickel-plated aluminium, copper, nickel-plated stranded. More about them.

— Aluminium. The traditional, most common backing material. At a relatively low cost, aluminium has good thermal conductivity characteristics, is easy to grind (required for a snug fit), and well resists scratches and other irregularities, as well as corrosion. However in terms of heat removal efficiency, this material is still inferior to copper — however, this becomes noticeable mainly in advanced systems that require the highest possible thermal conductivity.

— Copper. Copper is noticeably more expensive than aluminium, but this is offset by higher thermal conductivity and, accordingly, cooling efficiency. The noticeable disadvantages of this metal include some tendency to corrosion when exposed to moisture and certain substances. Therefore, pure copper is used relatively rarely — nickel-plated substrates are more common (see below).

— Nickel-plated copper. Copper substrate with an additional n...ickel coating. Such a coating increases resistance to corrosion and scratches, while it practically does not affect the thermal conductivity of the substrate and work efficiency. However this feature somewhat increases the price of the radiator, but it is found mainly in high-end cooling systems, where this moment is almost invisible against the background of the overall cost of the device.

— Nickel-plated aluminium. Aluminium substrate with an additional nickel coating. For aluminium in general, see above, and the coating makes the heatsink more resistant to corrosion, scratches, and burrs. On the other hand, it affects the cost, despite the fact that in fact, pure aluminium is often quite sufficient for efficient operation (especially since this metal itself is very resistant to corrosion). Therefore, this variant was not distributed.

The colour of the backlight installed in the cooling system.

See above for more details on the backlight itself. Also note here that in the illumination of modern cooling systems there is both one colour (most often red or blue, less often green, yellow, white or purple), and multi-colour systems such as RGB and ARGB. The choice of a single-colour backlight depends mainly on aesthetic preferences, but the last two varieties should be touched upon separately.

The basic principle of operation of both RGB and ARGB systems is the same: the design provides for a set of LEDs of three basic colours — red (Red), green (Green) and blue (Blue), and by changing the number and brightness of the included LEDs, you can not only intensity, but and tint of light. The difference between these options differs in functionality: RGB systems support a limited set of colours (usually up to one and a half dozen, or even less), while ARGB allows you to choose almost any shade from the entire available colour range. At the same time, both of them can support backlight synchronization (see below); in general, this function is not required for RGB and ARGB systems, but it is used almost exclusively in them.

General dimensions of the cooling system. For water systems (see "Type"), this paragraph indicates the size of the external radiator (the dimensions of the water block in such devices are small, and there is no need to specify them in particular).

In general, this is a fairly obvious parameter. We only note that for case fans (see ibid.), the thickness is of particular importance — it directly depends on how much space the device will take up inside the system unit. At the same time, it is customary to refer to fans with a thin case for models in which this size does not exceed 20 mm.

The cooling system should fit into the computer case without any problems. The vast majority of case manufacturers indicate in the specifications the maximum height of the cooler that can be installed on their chassis. It is from this value that it is necessary to build on when choosing a cooling system. With an oversized cooler, you will have to leave the side wall of the case wide open, which violates the built-in air circulation pattern and provokes dust pollution of the internal space of the system unit.