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Comparison GOODRAM IRDM X DDR4 1x8Gb IR-X2666D464L16S/8G vs Crucial Ballistix Sport LT DDR4 1x8Gb BLS8G4D26BFSCK

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GOODRAM IRDM X DDR4 1x8Gb IR-X2666D464L16S/8G
Crucial Ballistix Sport LT DDR4 1x8Gb BLS8G4D26BFSCK
GOODRAM IRDM X DDR4 1x8Gb IR-X2666D464L16S/8GCrucial Ballistix Sport LT DDR4 1x8Gb BLS8G4D26BFSCK
from $122.00 
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Memory capacity8 GB8 GB
Memory modules11
Form factorDIMMDIMM
TypeDDR4DDR4
Memory ranksingle ranksingle rank
Specs
Memory speed2666 MHz2666 MHz
Clock speed21300 MB/s21300 MB/s
CAS latencyCL16CL16
Memory timing16-18-1816-18-18
Voltage1.2 V1.2 V
Coolingradiatorradiator
Module profilestandardstandard
Module height34 mm33 mm
More features
 
 
overclocking series
XMP
Color
Added to E-Catalogfebruary 2018june 2017

More features

— A series for overclocking (overclocking). Belonging to such a series means that the manufacturer initially provided in the module the possibility of overclocking ("overclocking") — that is, increasing performance by changing the operating parameters, in particular, increasing the operating voltage and clock frequency. You can also “overclock” ordinary memory that is not related to overclocking — however, this is difficult and fraught with failures, up to complete burnout of the circuits, while in specialized series overclocking is a documented function, it is implemented quickly and simply, moreover, it is most often covered by a guarantee.

XMP support. Memory module compatibility with XMP technology. This technology, created by Intel, is used for overclocking (see the relevant paragraph). Its key principle is that certain overclocking profiles are recorded in the memory module — sets of settings tested for stability; and instead of manually setting individual parameters, the user just needs to select one of the profiles. This simplifies system setup and at the same time improves its reliability during overclocking. However, note that in order to use XMP, it must be supported not only by memory, but also by the motherboard.

— AMP support. Memory module compatibility with AMP technology. In terms of its main features, this technology is completely similar to the XMP described above and differs only in the creator — in this case, it is AMD.

EXPO support. Memory module compatibility with EXPO technology (Extended Profiles for Overclocking). It was created at AMD by a specialist for overclocking DDR5 strips as part of Ryzen 7000 systems. At its core, this is a factory set of RAM profiles that simplifies overclocking the “RAM”. Using the technology allows you to increase performance in games by about 11% with a resolution of the broadcast image Full HD.

Buffering support (Registered). The presence of the so-called memory module. buffer — a section for quickly saving incoming data — between the memory controller (control device) and the actual chips (storage devices). This scheme reduces the load on the controller, thereby achieving higher reliability; on the other hand, buffered modules have slightly reduced performance due to the delay in transferring information through the buffer. Buffered memory is used mainly in server systems and is expensive. When choosing memory, note that either only buffered or only unbuffered memory can be used in one system; it is impossible to combine these two types of memory.

ECC support. ECC (Error Checking and Correction) is a technology that allows you to correct minor errors that occur while working with data. To use ECC, it must be supported not only by the memory module, but also by the motherboard; Basically, such support is used in servers, but it is also found in "motherboards" for ordinary desktops.
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