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Comparison HyperX Fury DDR4 2x16Gb HX424C15FBK2/32 vs Crucial Value DDR4 1x8Gb CT8G4DFS8213

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HyperX Fury DDR4 2x16Gb HX424C15FBK2/32
Crucial Value DDR4 1x8Gb CT8G4DFS8213
HyperX Fury DDR4 2x16Gb HX424C15FBK2/32Crucial Value DDR4 1x8Gb CT8G4DFS8213
from $194.75
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Memory capacity32 GB8 GB
Memory modules21
Form factorDIMMDIMM
TypeDDR4DDR4
Memory rankdual ranksingle rank
Specs
Memory speed2400 MHz2133 MHz
Clock speed19200 MB/s17000 MB/s
CAS latencyCL15CL15
Memory timing15-15-1515-15-15
Voltage1.2 V1.2 V
Coolingradiatorno cooling
Module profilestandardstandard
Module height34 mm
More features
overclocking series
XMP
 
 
Color
Added to E-Catalogapril 2016april 2016

Memory capacity

The total volume of all modules of the RAM kit.

Knowing this parameter and the number of planks in the set, you can estimate the volume of one plank. This information can be useful for assessing compatibility with a specific PC: any motherboard has a limit on the maximum volume of each individual bar.

Now on the market there are kits with such a volume of memory: 4 GB, 8 GB, 16 GB, 24 GB, 32 GB, 64 GB and even 128 GB. The combination of several sticks allows you to sell sets of 8 GB (2 sticks of 4 GB), 16 GB (2 sticks of 8 GB), 16 GB (4 sticks of 4 GB), 32 GB (2 sticks of 16 GB), 32 GB (4 8 GB sticks), 48 GB (2 24 GB sticks). 64 GB kits are represented by the following sets: 64 GB (2 sticks of 32 GB), 64 GB (4 sticks of 16 GB) and 64 GB (8 sticks of 8 GB). 128 GB RAM mainly consists of 4 sticks of 32 GB or 8 sticks of 16 GB. And 256 GB and 96 GB (2 sticks of 48 GB each) are not so popular

Memory modules

The number of individual modules included in RAM kit. One module occupies one slot on the motherboard, so to install the entire kit, the number of free slots must be equal to or greater than the number of modules.

If there is an even number of modules in the set, they can be paired. This mode significantly increases the speed, but is not supported by all models of motherboards, so in each case this point should be clarified separately.

Now on the market? there are modules supplied in such quantity: one modules, set of 2 modules, set of 4 modules, set of 8 modules.

Memory rank

The number of ranks provided in the memory bar.

The rank in this case is called one logical module — a chipset with a total capacity of 64 bits. If there is more than one rank, this means that several logical ones are implemented on one physical module, and they use the data transmission channel alternately. A similar design is used in order to achieve large amounts of RAM with a limited number of slots for individual brackets. At the same time, it should be said that for consumer computers, you can not pay much attention to the memory rank — more precisely, peer-to-peer modules are quite enough for them. But for servers and powerful workstations, two-, four- and even eight-rank solutions are produced.

Note that other things being equal, a larger number of ranks allows achieving larger volumes, however, it requires more computing power and increases the load on the system.

Memory speed

The clock frequency of the RAM module.

The higher this indicator, the faster the “RAM” works, other things being equal, the higher its efficiency in games and other resource-intensive applications. On the other hand, a high clock frequency has a corresponding effect on the cost. In addition, in order to use the full capabilities of the memory, the motherboard to which the module is connected must support the appropriate frequency.

The most popular are modules with a frequency of 3200 and 3600 MHz - so to speak, universal workhorses. There are also more modest options - for example 2400, 2666, 2800, 2933, 3000 MHz. And advanced for serious tasks - 3866, 4000, 4800, 5200, 5600 MHz. High-frequency modules 6000, 6400, 6600, 6800, 7000, 7200 MHz and more are also provided.

Clock speed

The amount of information that a memory module can receive or transmit in one second. The speed of the memory and, accordingly, the price of it directly depend on the bandwidth. At the same time, this is a rather specific parameter, which is relevant mainly for high-performance systems — gaming and workstations, servers, etc. If the RAM module is bought for a regular home or office system, you can not pay much attention to bandwidth.

Cooling

Type of cooling provided in the design of RAM.

No refrigeration. The lack of special cooling is typical for memory modules with low and medium power — they do not emit so much heat that it needs to be specially removed.

— Radiator. A device in the form of a metal structure with a characteristic ribbed surface — this form increases the area of \u200b\u200bcontact with air, which, in turn, improves heat transfer. The simplest type of cooling system is inferior in efficiency to a radiator with a cooler and even more so to a water circuit (see below), but it does not create noise, does not consume excess energy and does not require additional power or tubes. And the mentioned efficiency is enough even for quite powerful RAM modules.

— Radiator with cooler. Radiator cooling(see above), supplemented by a block with a fan (fans) for forced air circulation. This add-on significantly increases the efficiency of the heatsink; it can be used even in fairly powerful RAM sets. On the other hand, the fan creates noise during operation and significantly increases power consumption.

— Water cooling. Cooling in the form of a liquid heat exchanger connected to the water cooling circuit of the computer system. A distinctive external feature of such cooling are two characteristic pipes. Water systems are very efficient and suitable even for the mo...st powerful and “hot” sticks, but they are difficult to connect and require expensive external equipment, and therefore they are mainly used among top RAM models, in which such cooling is in principle indispensable. Note that some of these models allow operation “dry”, without water, but this is not recommended — failures may occur at high loads.

— Liquid-air. In accordance with the name, this option involves the use of two types of cooling at once — air (radiator) and water. See above for both, but it is worth noting that in this case water cooling can be provided in a somewhat “truncated” form — not in the form of pipes for connecting to a common cooling circuit, but in the form of a sealed capsule with a heat-conducting liquid. In terms of efficiency, such systems, of course, noticeably lose to classical liquid ones — but they do not require complex connections; and the capsule somehow improves the efficiency of the radiator, and it looks unusual.

More features

— A series for overclocking (overclocking). Belonging to such a series means that the manufacturer initially provided in the module the possibility of overclocking ("overclocking") — that is, increasing performance by changing the operating parameters, in particular, increasing the operating voltage and clock frequency. You can also “overclock” ordinary memory that is not related to overclocking — however, this is difficult and fraught with failures, up to complete burnout of the circuits, while in specialized series overclocking is a documented function, it is implemented quickly and simply, moreover, it is most often covered by a guarantee.

XMP support. Memory module compatibility with XMP technology. This technology, created by Intel, is used for overclocking (see the relevant paragraph). Its key principle is that certain overclocking profiles are recorded in the memory module — sets of settings tested for stability; and instead of manually setting individual parameters, the user just needs to select one of the profiles. This simplifies system setup and at the same time improves its reliability during overclocking. However, note that in order to use XMP, it must be supported not only by memory, but also by the motherboard.

— AMP support. Memory module compatibility with AMP technology. In terms of its main features, this technology is completely similar to the XMP described above and differs only in the creator — in this case, it is AMD.

EXPO support. Memory module compatibility with EXPO technology (Extended Profiles for Overclocking). It was created at AMD by a specialist for overclocking DDR5 strips as part of Ryzen 7000 systems. At its core, this is a factory set of RAM profiles that simplifies overclocking the “RAM”. Using the technology allows you to increase performance in games by about 11% with a resolution of the broadcast image Full HD.

Buffering support (Registered). The presence of the so-called memory module. buffer — a section for quickly saving incoming data — between the memory controller (control device) and the actual chips (storage devices). This scheme reduces the load on the controller, thereby achieving higher reliability; on the other hand, buffered modules have slightly reduced performance due to the delay in transferring information through the buffer. Buffered memory is used mainly in server systems and is expensive. When choosing memory, note that either only buffered or only unbuffered memory can be used in one system; it is impossible to combine these two types of memory.

ECC support. ECC (Error Checking and Correction) is a technology that allows you to correct minor errors that occur while working with data. To use ECC, it must be supported not only by the memory module, but also by the motherboard; Basically, such support is used in servers, but it is also found in "motherboards" for ordinary desktops.
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