Akasa SOHO H7 Premium Dual Tower 7-Heatpipe CPU Cooler with Addressable RG
$182.00 Buy! Akasa SOHO H7 Premium Dual Tower 7-Heatpipe CPU Cooler with Addressable RGAmazon.comDelivery: in USA Report |
Buy Akasa SOHO H7 Premium Dual Tower 7-Heatpipe CPU Cooler with Addressable RG
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Akasa SOHO H7 Premium Dual Tower 7-Heatpipe CPU Cooler with Addressable RG | $181.99 |
[ Extreme Cooling Performance ] - Elevate cooling efficiency to the max with 7 high-performance copper heat pipes and an increased copper base. Designed for CPUs with a maximum TDP of 250W.
[ Dual Tower Design, Dual Fan Operation] - High-density aluminium heatsinks design and 120 mm RGB fans with PWM control for superior heat dissipation. Perfect for extreme gaming and overclocking PC!
[ Elegant Aesthetics ] - Customise your aRGB lighting with 16.8 million colour combinations. Sync with popular RGB software providers. Brushed aluminium top cover provides durability and a glossy, delicate finish.
[ Socket and Memory Compatibility ] - Specially designed for RAM compatibility including mini-ITX motherboards. Suitable for Intel LGA 20XX, 1200, 1700,115X and AMD AM4, AM5 sockets.
[ Included Ultra-Performance Thermal Paste ] - Akasa T5 Pro-Grade Plus is included with hybrid silicone and nano-diamond particles for the ultimate thermal conductivity between CPU and air cooler.
[ Dual Tower Design, Dual Fan Operation] - High-density aluminium heatsinks design and 120 mm RGB fans with PWM control for superior heat dissipation. Perfect for extreme gaming and overclocking PC!
[ Elegant Aesthetics ] - Customise your aRGB lighting with 16.8 million colour combinations. Sync with popular RGB software providers. Brushed aluminium top cover provides durability and a glossy, delicate finish.
[ Socket and Memory Compatibility ] - Specially designed for RAM compatibility including mini-ITX motherboards. Suitable for Intel LGA 20XX, 1200, 1700,115X and AMD AM4, AM5 sockets.
[ Included Ultra-Performance Thermal Paste ] - Akasa T5 Pro-Grade Plus is included with hybrid silicone and nano-diamond particles for the ultimate thermal conductivity between CPU and air cooler.
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