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Thermal Grizzly Minus Pad 30 x 30 x 1 mm Minus Pad 8 TG-MP8-30-30-10-1R

Photos - Thermal Paste Thermal Grizzly Minus Pad 30 x 30 x 1 mm Minus Pad 8 TG-MP8-30-30-10-1R
Thermal Grizzly Minus Pad 30 x 30 x 1 mm Minus Pad 8 TG-MP8-30-30-10-1R
from $10.00 

Buy Thermal Grizzly Minus Pad 30 x 30 x 1 mm Minus Pad 8 TG-MP8-30-30-10-1R

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Thermal Grizzly Minus Pad 30 x 30 x 1 mm Minus Pad 8 TG-MP8-30-30-10-1R

8W/(m·K) THERMAL CONDUCTIVITY - Highly conductive and versatile, suitable for a wide range of configurations with basic to high requirements. COMPATIBILITY - Suitable for use with computers, laptops, PS3/4/5, Xbox 360/One/Series X consoles and Macbooks. UPGRADE - Designed for office, home, and gaming computers, catering to users who demand optima... morel performance from their equipment. GREAT RESULTS - The ceramic silicone and nano-aluminum oxide thermal pad effectively dissipates heat between components by filling small gaps with its flexible, highly conductive structure. USECASE - This is used in situations where thermal paste is not feasible, such as when dealing with a big air gap or an uneven substrate.
Amazon.com
Delivery: in USA
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$10.44

Thermal Grizzly Minus Pad 8 (Thermal Pad) 30x30x1.0mm TG-MP8-30-30-10-1R

Single thermal pad with dimensions of 30mm x 30mm Thickness of 1.0mm Highly elastic and flexible surface area and ultra-high thermal conductivity Engineered in Germany by Thermal Grizzly
Newegg.com
Delivery: in USA
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$9.99
8W/(m·K) THERMAL CONDUCTIVITY - Highly conductive and versatile, suitable for a wide range of configurations with basic to high requirements.
COMPATIBILITY - Suitable for use with computers, laptops, PS3/4/5, Xbox 360/One/Series X consoles and Macbooks.
UPGRADE - Designed for office, home, and gaming computers, catering to users who demand optimal performance from their equipment.
GREAT RESULTS - The ceramic silicone and nano-aluminum oxide thermal pad effectively dissipates heat between components by filling small gaps with its flexible, highly conductive structure.
USECASE - This is used in situations where thermal paste is not feasible, such as when dealing with a big air gap or an uneven substrate.
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