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Comparison ID-COOLING SE-207-XT Advanced vs ID-COOLING SE-226-XT Black

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ID-COOLING SE-207-XT Advanced
ID-COOLING SE-226-XT Black
ID-COOLING SE-207-XT AdvancedID-COOLING SE-226-XT Black
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Main specs
Featuresfor CPUfor CPU
Product typeair coolerair cooler
Air flow directionsideways (dispersion)sideways (dispersion)
Double-tower
Max. TDP280 W250 W
Fan
Number of fans21
Fan size120 mm120 mm
Fan thickness25 mm
Bearinghydrodynamichydrodynamic
Min. RPM700 rpm700 rpm
Max. RPM1800 rpm1800 rpm
Speed controllerauto (PWM)auto (PWM)
Max. air flow82.5 CFM76.16 CFM
Static pressure2.55 mm H2O2.16 mm H2O
Starting voltage7 В7 В
replaceable
Min noise level15 dB15 dB
Noise level35 dB35 dB
Power source4-pin4-pin
Radiator
Heat pipes76
Heatpipe contactindirectindirect
Heatsink materialaluminium / copperaluminium / copper
Plate materialnickel-plated coppernickel-plated copper
Socket
AMD AM4
AMD AM5
Intel 1150
Intel 1155/1156
Intel 2011 / 2011 v3
Intel 2066
Intel 1151 / 1151 v2
Intel 1200
Intel 1700 / 1851
AMD AM4
AMD AM5
Intel 1150
Intel 1155/1156
Intel 2011 / 2011 v3
Intel 2066
Intel 1151 / 1151 v2
Intel 1200
Intel 1700 / 1851
General
Mount typebilateral (backplate)bilateral (backplate)
Dimensions120x110x154 mm129x106x154 mm
Height154 mm154 mm
Weight1020 g910 g
Added to E-Catalognovember 2023december 2021
Glossary

Double-tower

A feature found in some active CPU coolers (see "Intended Use").

For tower arrangements in general, see Airflow Blowing below. And the double-tower design means that the cooler has two working blocks — that is, two fans and two radiators. Accordingly, there are more heat pipes in the design than in single-tower models — at least 4 of them, and more often 5 – 6 or even more. Such an arrangement can significantly increase the cooling efficiency; on the other hand, it also significantly affects the dimensions, weight and price.

Max. TDP

The maximum TDP provided by the cooling system. Note that this parameter is indicated only for solutions equipped with heatsinks (see "Type"); for separately made fans, the efficiency is determined by other parameters, primarily by the air flow values (see above).

TDP can be described as the amount of heat that a cooling system is able to remove from a serviced component. Accordingly, for the normal operation of the entire system, it is necessary that the TDP of the cooling system is not lower than the heat dissipation of this component (heat dissipation data is usually indicated in the detailed characteristics of the components). And it is best to select coolers with a power margin of at least 20 – 25% — this will give an additional guarantee in case of forced operation modes and emergency situations (including clogging of the case and reduced air exchange efficiency).

As for specific numbers, the most modest modern cooling systems provide TDP up to 100 W, the most advanced — up to 250 W and even higher.

Number of fans

The number of fans in the design of the cooling system. More fans provide higher efficiency (all else being equal); on the other hand, the dimensions and the noise generated during operation also increase accordingly. Also, note that other things being equal, a smaller number of large fans is considered more advanced than numerous small ones; see "Fan diameter" for details.

Fan thickness

This parameter must be considered in the context of whether the fan will fit into the computer case. Standard case fans are available in the order of 25 mm in thickness. Low-profile coolers with a thickness of about 15 mm are designed for small-sized cases, where saving space is extremely important. Fans of large thickness (30-40 mm) boast high cooling efficiency due to the increased impeller dimensions. However, they are noisier than standard models at the same speed and do not always fit into the case normally, sometimes touching other components.

Max. air flow

The maximum airflow that a cooling fan can create; measured in CFM — cubic feet per minute.

The higher the CFM number, the more efficient the fan. On the other hand, high performance requires either a large diameter (which affects the size and cost) or high speed (which increases the noise and vibration levels). Therefore, when choosing, it makes sense not to chase the maximum air flow, but to use special formulas that allow you to calculate the required number of CFM depending on the type and power of the cooled component and other parameters. Such formulas can be found in special sources. As for specific numbers, in the most modest systems, the performance does not exceed 30 CFM, and in the most powerful systems it can be up to 80 CFM and even more.

It is also worth considering that the actual value of the air flow at the highest speed is usually lower than the claimed maximum; see Static Pressure for details.

Static pressure

The maximum static air pressure generated by the fan during operation.

This parameter is measured as follows: if the fan is installed on a blind pipe, from which there is no air outlet, and turned on for blowing, then the pressure reached in the pipe will correspond to the static one. In fact, this parameter determines the overall efficiency of the fan: the higher the static pressure (ceteris paribus), the easier it is for the fan to “push” the required amount of air through a space with high resistance, for example, through narrow slots of a radiator or through a case full of components.

Also, this parameter is used for some specific calculations, however, these calculations are quite complex and, usually, are not necessary for an ordinary user — they are associated with nuances that are relevant mainly for computer enthusiasts. You can read more about this in special sources.

Heat pipes

Number of heat pipes in the cooling system

The heat pipe is a hermetically sealed structure containing a low-boiling liquid. When one end of the tube is heated, this liquid evaporates and condenses at the other end, thus removing heat from the heating source and transferring it to the cooler. Nowadays, such devices are widely used mainly in processor cooling systems (see "Intended use") — they connect the substrate that is in direct contact with the CPU and the heatsink of the active cooler. Manufacturers select the number of tubes based on the overall performance of the cooler (see "Maximum TDP"); however, models with similar TDPs can still differ markedly in this parameter. In such cases, it is worth considering the following: increasing the number of heat pipes increases the efficiency of heat transfer, but also increases the dimensions, weight and cost of the entire structure.

As for the number, the simplest models provide 1 – 2 heat pipes, and in the most advanced and powerful processor systems, this number can be 7 or more.

Dimensions

General dimensions of the cooling system. For water systems (see "Type"), this paragraph indicates the size of the external radiator (the dimensions of the water block in such devices are small, and there is no need to specify them in particular).

In general, this is a fairly obvious parameter. We only note that for case fans (see ibid.), the thickness is of particular importance — it directly depends on how much space the device will take up inside the system unit. At the same time, it is customary to refer to fans with a thin case for models in which this size does not exceed 20 mm.
ID-COOLING SE-207-XT Advanced often compared
ID-COOLING SE-226-XT Black often compared