Thermaltake TG-50 (CL-O024-GROSGM-A)

[High Performance] Contains diamond powder for higher heat transfer providing a thermal conductivity of 8.0 W/m-k. [All-In-One Application Kit] Includes tools to clean, prep, and install fresh thermal compound to your hardware. [Easy to Apply] Specially formulated to easily spread over the included honeycomb stencil for consistent compound applic... moreation, providing a neat and well-covered CPU. [Sustainability and Safety] The TG-50 is a non-electrically conductive compound eliminating risk of short circuit and offers a longer lifespan minimizing dry-out or cracking.

Designed to lower CPU temperatures effectively, TG-50 is a premium thermal compound which contains diamond powder to improve thermal conductivity to maximize heat transfer, providing a longer lifespan eliminating dry-out or cracking while in use. This thermal compound application kit includes a set of easily-applied tools for immediate use. On top... moreof that, the TG-50 s honeycomb stencil can help users to apply thermal compound for a neat and well-covered surface which fits all CPUs