Gembird TG-G15-02
 | Outdated Product Affordable and effective entry-level thermal paste for a wide range of users. It is necessary in order to improve the transfer of heat from a heating electronic component (central or graphics processor, power key, chip) to the base of the radiator of the cooling system. Due to its moderate viscosity, it fills the micro-irregularities of the contacting surfaces, removing from them the thermal insulator - air. Practically does not conduct electric current, if it gets on the printed circuit board, it will not cause short circuits. It is quite capable of playing the role of a standard thermal interface for PC / laptop / video card maintenance and participating in accurate overclocking experiments. Supplied in a small plastic jar containing 15 g of paste with a density of 3.15 g/cm3. This volum...e (4.76 cm3) is sufficient for 10-12 CPU installations with a large heat spreader cover (AMD TR4, Intel LGA3647) or 15-25 CPU installations with a smaller heat dissipation area. The thermal conductivity declared by the manufacturer (4.63 W / m∙K) is quite comparable with thermal pastes of the middle price category. Suitable for air and liquid cooling systems. Can be used in industrial and consumer electronics. |
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Affordable and effective entry-level thermal paste for a wide range of users. It is necessary in order to improve the transfer of heat from a heating electronic component (central or graphics processor, power key, chip) to the base of the radiator of the cooling system. Due to its moderate viscosity, it fills the micro-irregularities of the contacting surfaces, removing from them the thermal insulator - air.
Practically does not conduct electric current, if it gets on the printed circuit board, it will not cause short circuits. It is quite capable of playing the role of a standard thermal interface for PC / laptop / video card maintenance and participating in accurate overclocking experiments. Supplied in a small plastic jar containing 15 g of paste with a density of 3.15 g/cm3. This volume (4.76 cm3) is sufficient for 10-12 CPU installations with a large heat spreader cover (AMD TR4, Intel LGA3647) or 15-25 CPU installations with a smaller heat dissipation area. The thermal conductivity declared by the manufacturer (4.63 W / m∙K) is quite comparable with thermal pastes of the middle price category. Suitable for air and liquid cooling systems. Can be used in industrial and consumer electronics.
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