Thermal Pastes & Thermal Pads Akasa

[ Effective Thermal Paste Remover TIM Cleaning ] - Pre-moistened with a safe citrus-based solvent, TIM Clean fluid, which effectively emulsifies and removes TIM, leaving no residue. [ Perfect for PC more→builds ] - Ideal for PC enthusiasts for cleaning CPUs, GPUs and chipset surfaces, or heatsink bases for the application of new thermal interface. [ Convenient & Practical ] - Large size of 180 x 175 mm allows for cleaning of both CPU and heatsink with one wipe. [ Individually Packaged ] - Includes 10 individually packaged thermal paste wipes. [ TFT Recommended ] - We are incredibly proud to have received the award from Tech For Techs for our TIM Wipes thermal paste cleaner!

Akasa Performance Compound 455 Kit Tim Wipe Kit Thermal Paste Remover Ther

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[ Complete Solution ] - All-in-one chipset preparation kit complete with 5g AK-455 thermal compound, a spreader and 5 individually packaged TIM cleaning wipes. [ Effective TIM Cleaning ] - Wipes come more→moistened with a safe citrus-based solvent, TIM Clean fluid, to effectively remove all thermal interfaces, leaving no residue. [ High Performance ] - Thermally advanced AK-455 thermal compound maximises heat transfer from CPU to heatsink for superb cooler performance. Suitable for high wattage CPUs. [ TFT Recommended / Perfect for PC Builds ] - We have received the award from Tech For Techs for our TIM Wipe Kit! Ideal for every PC enthusiast for cleaning CPUs, GPUs and chipset surfaces, or heatsink …

Akasa AK-TT300-02 30 x 30 x 5 mm Thermal Gap Filler

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Thermally conductive interface pad which is versatile and suitable for use between components and their heat sinks Moulds around uneven surfaces and can be cut to size to effectively solve and manage more→unwanted thermal issues Size: 30 x 30 x 5mm Quantity: Contains 2 pieces of thermal gap filler Thermal conductivity: 1.2 W/make

Akasa AK-TT300-01 30 x 30 x 15 mm Thermal Gap Filler

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Thermally conductive interface pad which is versatile and suitable for use between components and their heat sinks Moulds around uneven surfaces and can be cut to size to effectively solve and manage more→unwanted thermal issues Size: 30 x 30 x 1.5mm Quantity: Contains 2 pieces of thermal gap filler Thermal conductivity: 1.2 W/make