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Comparison G.Skill Aegis DDR4 2x8Gb F4-3200C16D-16GIS vs Corsair Vengeance LPX DDR4 2x8Gb CMK16GX4M2B3200C16

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G.Skill Aegis DDR4 2x8Gb F4-3200C16D-16GIS
Corsair Vengeance LPX DDR4 2x8Gb CMK16GX4M2B3200C16
G.Skill Aegis DDR4 2x8Gb F4-3200C16D-16GISCorsair Vengeance LPX DDR4 2x8Gb CMK16GX4M2B3200C16
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Memory capacity16 GB16 GB
Memory modules22
Form factorDIMMDIMM
TypeDDR4DDR4
Memory ranksingle rank
Specs
Memory speed3200 MHz3200 MHz
Clock speed25600 MB/s25600 MB/s
CAS latencyCL16CL16
Memory timing16-18-18-3816-18-18-36
Voltage1.35 V1.35 V
Coolingno coolingradiator
Module profilestandardstandard
Module height31.2 mm33 mm
More features
overclocking series
XMP
overclocking series
XMP
Color
Added to E-Catalogdecember 2019november 2015

Memory rank

The number of ranks provided in the memory bar.

The rank in this case is called one logical module — a chipset with a total capacity of 64 bits. If there is more than one rank, this means that several logical ones are implemented on one physical module, and they use the data transmission channel alternately. A similar design is used in order to achieve large amounts of RAM with a limited number of slots for individual brackets. At the same time, it should be said that for consumer computers, you can not pay much attention to the memory rank — more precisely, peer-to-peer modules are quite enough for them. But for servers and powerful workstations, two-, four- and even eight-rank solutions are produced.

Note that other things being equal, a larger number of ranks allows achieving larger volumes, however, it requires more computing power and increases the load on the system.

Memory timing

Timing is a term that refers to the time it takes to complete an operation. To understand the timing scheme, you need to know that structurally RAM consists of banks (from 2 to 8 per module), each of which, in turn, has rows and columns, like a table; when accessing memory, the bank is selected first, then the row, then the column. The timing scheme shows the time during which the four main operations are performed when working with RAM, and is usually written in four digits in the format CL-Trcd-Trp-Tras, where

CL is the minimum delay between receiving a command to read data and the start of their transfer;

Trcd — the minimum time between the selection of a row and the selection of a column in it;

Trp is the minimum time to close a row, that is, the delay between the signal and the actual closing. Only one bank line can be opened at a time; Before opening the next line, you must close the previous one.

Tras — the minimum time the row is active, in other words, the shortest time after which the row can be commanded to close after it has been opened.

Time in the timing scheme is measured in cycles, so the actual memory performance depends not only on the timing scheme, but also on the clock frequency. For example, 1600 MHz 8-8-8-24 memory will run at the same speed as 800 MHz 4-4-4-12 memory—in either case timings, if expressed in nanoseconds, will be 5-5-5-15.

Cooling

Type of cooling provided in the design of RAM.

No refrigeration. The lack of special cooling is typical for memory modules with low and medium power — they do not emit so much heat that it needs to be specially removed.

— Radiator. A device in the form of a metal structure with a characteristic ribbed surface — this form increases the area of \u200b\u200bcontact with air, which, in turn, improves heat transfer. The simplest type of cooling system is inferior in efficiency to a radiator with a cooler and even more so to a water circuit (see below), but it does not create noise, does not consume excess energy and does not require additional power or tubes. And the mentioned efficiency is enough even for quite powerful RAM modules.

— Radiator with cooler. Radiator cooling(see above), supplemented by a block with a fan (fans) for forced air circulation. This add-on significantly increases the efficiency of the heatsink; it can be used even in fairly powerful RAM sets. On the other hand, the fan creates noise during operation and significantly increases power consumption.

— Water cooling. Cooling in the form of a liquid heat exchanger connected to the water cooling circuit of the computer system. A distinctive external feature of such cooling are two characteristic pipes. Water systems are very efficient and suitable even for the mo...st powerful and “hot” sticks, but they are difficult to connect and require expensive external equipment, and therefore they are mainly used among top RAM models, in which such cooling is in principle indispensable. Note that some of these models allow operation “dry”, without water, but this is not recommended — failures may occur at high loads.

— Liquid-air. In accordance with the name, this option involves the use of two types of cooling at once — air (radiator) and water. See above for both, but it is worth noting that in this case water cooling can be provided in a somewhat “truncated” form — not in the form of pipes for connecting to a common cooling circuit, but in the form of a sealed capsule with a heat-conducting liquid. In terms of efficiency, such systems, of course, noticeably lose to classical liquid ones — but they do not require complex connections; and the capsule somehow improves the efficiency of the radiator, and it looks unusual.
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