Asus Sabertooth Z77
![]() | Outdated Product $179.99 Socket: Intel LGA 1155; Form factor: ATX; Size (mm): 305x244; Chipset: Intel Z77; DDR3 (slots): 4; Memory module: DIMM; Max. memory (GB): 32; SATA 3: 4; eSATA connector: 2; PCI Express: 3.0; HDMI; Sound (channels): 5.1; Optical S/P-DIF; LAN: 1 Gbps; USB 2.0: 4; USB 3.2 gen1: 4; Main power socket: 24 pin |
Asus Sabertooth Z77
Towards:gaming
Form Factor:ATX
Socket:Intel LGA 1155
Chipset:Intel Z77
BIOS:Ami
RAM slots:DDR3 4 sl
RAM form factor:DIMM
Sound (channels):5.1
Connectors:eSATA, HDMI
Additional connectors:DisplayPort
Power connector:24 pin
Processor power:8 pin
All specifications
Specifications Sabertooth Z77
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The information in the model description is for reference purposes.
Always clarify the specifications and configuration of the product with the online store manager before purchasing.
Catalog Asus 2025 - new arrivals, bestsellers, and the most relevant models Asus.
Always clarify the specifications and configuration of the product with the online store manager before purchasing.
Catalog Asus 2025 - new arrivals, bestsellers, and the most relevant models Asus.
Additional features motherboard Asus Sabertooth Z77:
Thermal Armor Cooling System
The entire surface of the motherboard is covered with a thermal material that serves to separate its components from hot devices such as a graphics card and the central processor, as well as for improved cooling of the motherboard itself by optimizing the airflow from the fans. According to the test results, this engineering solution helps to reduce the temperature of the board components by 13%, which ensures their stable operation and long service life.
- CMOS reset button
- Thermal Armor Cooling System
- Covers for PCI slots to protect against dust
Thermal Armor Cooling System
The entire surface of the motherboard is covered with a thermal material that serves to separate its components from hot devices such as a graphics card and the central processor, as well as for improved cooling of the motherboard itself by optimizing the airflow from the fans. According to the test results, this engineering solution helps to reduce the temperature of the board components by 13%, which ensures their stable operation and long service life.
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